Silicon Packaging Architect

Job Details: Job Description: The Role and Impact: As a Silicon Packaging Architect, you will play a pivotal role in translationally directly contribute to advancing Intel's silicon packaging capabilities, ensuring reliability, quality, and innovation in every solution. Business group: Join Intel's Data Center Group (DCG), a dynamic organization driving innovation in the design and devg product requirements into advanced package architecture specifications and delivering end-to-end solutions that meet physical, electrical, thermal, and cost requirements. You will lead technology tradeoff decisions, ensuring silicon packages adhere to rigorous standards and collaborate closely with cross-functional teams to drive seamless execution from design to production. Your expertise welopment of cutting-edge technologies that power global data infrastructure. Our team is dedicated to developing scalable solutions for complex workloads, enabling the world's digital transformation and advancing Intel's leadership in high-performance computing. Key Responsibilities: - Develop and define package architecture specifications based on product requirements, ensuring alignment with physical, electrical, thermal, and reliability standards. - Lead technology tradeoff evaluations to deliver optimal solutions that balance performance, manufacturability, and cost. - Collaborate with silicon, hardware, and packaging teams to ensure high-quality package designs and seamless integration into production workflows. - Oversee the end-to-end package development process, including design, processes, and procedures, while continuously improving packaging quality standards. - Troubleshoot packaging design challenges, identify root causes, and implement innovative and cost-effective solutions. - Partner with manufacturing teams to ensure smooth transitions of packaging designs and tapeouts to production environments. Qualifications: Minimum Qualifications: - Bachelor's degree in a relevant field (e.g., Electrical Engineering, Mechanical Engineering, Materials Science) with 6+ years of hands-on experience in package architecture, design, and development OR a Master's degree in a relevant field with 4+ years of experience OR a PhD in a relevant field with 2+ years of experience. - Proven expertise in package design and associated design tool SW Xpedition. - Proven expertise in electrical, thermal, and mechanical considerations and tradeoffs. - Proficiency in simulation tools for package analysis (e.g., thermal, mechanical, and signal integrity simulations). - Strong understanding of manufacturing processes and procedures for silicon packaging. - Demonstrated ability to troubleshoot and resolve packaging design challenges effectively. Preferred Qualifications: - Experience collaborating with cross-functional teams, including silicon, hardware, and manufacturing groups. - Strong communication skills to effectively convey tradeoff decisions and technical solutions.